PCB Assembly
Complete PCB
Assembly Services
End-to-end PCBA solutions — from component procurement and SMT assembly to testing and box build. We act as your extended manufacturing arm.
Our Services
Assembly Capabilities
Advanced surface-mount and through-hole technology, with full turnkey options for complex assemblies.
SMT Assembly
High-speed automated Surface Mount Technology lines capable of placing components down to 01005 packages, BGAs, and fine-pitch QFPs with 100% AOI inspection.
- BGA & Micro-BGA Placement
- 01005, 0201 Ultra-Fine Components
- Double-sided SMT Lines
- Lead-free & leaded reflow
Through-Hole & Mixed
Precision wave soldering and selective soldering for through-hole components, combined with manual stations for specialized connectors and heavy parts.
- Wave & Selective Soldering
- Mixed Technology (SMT + THT)
- Hand soldering by IPC-certified staff
- Connector & press-fit assembly
Turnkey & Box Build
Full-service solution: we manufacture the PCB, source all components, assemble the board, burn firmware, run functional tests, and build the final enclosure.
- Global Component Sourcing
- Firmware Flashing & Programming
- Functional & ICT Testing
- Final Enclosure Assembly
Process
The Turnkey Assembly Process
Procurement
Source authentic components globally, checking for end-of-life and alternates.
PCB Fabrication
Bare boards manufactured to exact DFM specifications in-house.
SMT / THT Assembly
Automated placement, reflow soldering, and wave / selective soldering.
AOI & X-Ray
100% automated optical inspection and X-ray for BGA components.
Functional Testing
In-circuit and functional test to verify every board performs to spec.
Packaging
ESD-safe packaging and worldwide shipping via trusted logistics partners.
Assembly Specs
Assembly Specifications
Our assembly lines handle the full spectrum of component packages — from massive heat-sink connectors down to the smallest 01005 passives.
Assembly Capability Data
Standard specifications for SMT and THT lines
| Min Component Size | 01005 (0.4mm × 0.2mm) |
| BGA Pitch | Down to 0.3mm |
| Placement Accuracy | ±25μm (3σ) |
| Solder Paste | Lead-free & leaded options |
| Reflow Profiles | SAC305, SnPb, Low-temp |
| Testing | AOI, X-Ray, Flying Probe, Functional ICT |
| Certifications | IPC-A-610 Class 2 & 3, J-STD-001 |
| Min MOQ | 1 board (prototype) |
Ready to Assemble Your Board?
Upload your Gerber files and BOM — we'll get back with a detailed assembly quote within 2 hours.